EE224: Physical Design of Micro- and Opto-Electronic Packages

Micro- and opto-electronic packaging and materials; mechanical properties and behavior, thermal stress in dissimilar materials, and predictive modeling. Design for reliability, dynamic response to shocks and vibrations; reliability evaluations and testing; plastic packages of IC devices; photonics packages, fiber optics structures, and new frontiers. Enrollment restricted to graduate students.

5 credits

Year	Fall	Winter	Spring	Summer

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