EE224: Physical Design of Micro- and Opto-Electronic Packages


Micro- and opto-electronic packaging and materials; mechanical properties and behavior, thermal stress in dissimilar materials, and predictive modeling. Design for reliability, dynamic response to shocks and vibrations; reliability evaluations and testing; plastic packages of IC devices; photonics packages, fiber optics structures, and new frontiers. Enrollment restricted to graduate students.

5 Credits

This class has not been taught recently.

While the information on this web site is usually the most up to date, in the event of a discrepancy please contact your adviser to confirm which information is correct.