*****COURSES ARE SUBJECT TO CHANGE*****
Micro- and opto-electronic packaging and materials; mechanical properties and behavior, thermal stress in dissimilar materials, and predictive modeling. Design for reliability, dynamic response to shocks and vibrations; reliability evaluations and testing; plastic packages of IC devices; photonics packages, fiber optics structures, and new frontiers. Enrollment restricted to graduate students. The Staff
This class has not been taught recently.
While the information on this web site is usually the most up to date, in the event of a discrepancy please contact your adviser to confirm which information is correct.